[Topic-models] 4th IEEE International Conference on Smart Computing (SMARTCOMP 2018) - Call for Papers

Marco Tiloca marco.tiloca at ri.se
Tue Dec 5 03:47:14 EST 2017


[Apologies for multiple copies]


**************************** CALL FOR PAPERS ****************************

                   4th IEEE International Conference on
                     Smart Computing (SMARTCOMP 2018) 
                  
                             June 18-20, 2018
                         Taormina, Sicily, Italy                      
                      
                          http://smart-comp.org 

*************************************************************************

SMARTCOMP is the premier conference on smart computing. Smart computing
is based on the synergistic combination of advances in sensing devices,
the Internet of Things (IoT), big data, machine learning, cognitive
computing, and artificial intelligence. Smart computing is a
multidisciplinary domain. Applications of smart computing can be found
in different societal domains including, but not limited to,
transportation, energy, environmental protection, smart and connected
communities, healthcare, banking, entertainment, and social media.
Algorithmic and system advancements of cloud computing, mobile/pervasive
computing, cyber-physical systems, sensor networking and social
computing are taking smart computing to a new dimension and improving
our ways of living.

SMARTCOMP 2018 invites high-quality papers on original research in
advanced algorithms, systems and platforms, and technologies for smart
computing. Under the theme of "Smart Living through Computing",
SMARTCOMP 2018 will be a forum for the presentation and exchange of
cutting-edge ideas. The conference will also feature forums and a panel
with distinguished scholars and industrial experts.

SMARTCOMP 2018 is soliciting contributions which present smart computing
innovations in all different technology aspects including
pervasive/ubiquitous computing, cloud computing, sensor networks, the
Internet of Things, big data analytics, security and privacy, social
computing, cognitive computing, and cyber-physical systems. A special
emphasis lies on the validation of such systems within smart computing
environments. Moreover, applications of smart computing systems are
welcome, such as smart buildings, smart cities, smart grids, precision
agriculture, and other societal applications contributing to smart living.
 

# TOPICS OF INTEREST

SMARTCOMP 2018 solicits submissions that address the fundamental
questions of smart computing, namely how to design and build smart
computing systems and how to use computing technology for resource
sustainability to improve the human experience. Submissions should thus
match to at least one of the following three major fields of interest:

1. SMART COMPUTING CONCEPTS, MODELS AND ALGORITHMS
* Future Smart Computing Paradigms
* Models of Smart Environments
* Algorithms for Smart Computing
 
2. SMART COMPUTING SYSTEMS
* Security, Privacy, and Economics in Smart Environments
* Cyber-physical System Platforms for Smart Environments
* Middleware Platforms for Smart Environments
* Mobile and Ubiquitous Platforms for Smart Environments
 
3. SMART COMPUTING TECHNOLOGIES AND APPLICATIONS
* Smart Precision Agriculture
* Smart Transportation
* Smart FinTech
* Smart Food-Energy-Water Nexus
* Smart Health
* Smart Communities
* Smart Human Environments, Entertainment, and Social Activities
* Smart Energy Management and Analytics


# SUBMISSION GUIDELINES

Paper submissions must be no longer than 8 pages and formatted according
to the two-column IEEE proceedings template. IEEE provides corresponding
formatting templates at
<http://www.ieee.org/conferences_events/conferences/publishing/templates.html>.
Make sure to use the conference mode of the template, i.e., LaTeX users
must use the conference option of the IEEEtran document class.

Papers must be submitted electronically as a single PDF file on US
Letter size paper (not A4), with all fonts embedded (the PDF-A standard
complies with that). Prior to submission, ensure that any running
headers/footers, page numbering, as well as blue underlining for URLs
and email addresses has been removed.

All submitted papers will be subject to peer reviews by Technical
Program Committee members and other experts in the field. All presented
papers will be published in the conference proceedings and submitted to
the IEEE Xplore Digital Library. Authors of selected high-quality papers
will be invited to submit substantially extended versions for a possible
fast-track publication in the Elsevier Journal on Pervasive and Mobile
Computing (PMC).


# IMPORTANT DATES

Paper registration:      January 17, 2018
Paper submission:        January 24, 2018
Acceptance notification: March 29, 2018
Camera-ready version:    April 21, 2018


# ORGANIZING COMMITTEES

GENERAL CO-CHAIRS
Giuseppe Anastasi (University of Pisa, Italy)
Nalini Venkatasubramanian (University of California at Irvine, USA)

TECHNICAL PROGRAM CO-CHAIRS
Andreas Reinhardt (TU Clausthal, Germany)
Antonio Puliafito (University of Messina, Italy)

WORKSHOPS CHAIR
Dario Bruneo (University of Messina, Italy)

KEYNOTE CO-CHAIRS
Sajal Das (Missouri University of Science & Technology, USA)
Jiannong Cao (Hong Kong Polytechnic University, Hong Kong)

WIP AND DEMO CHAIR
Marco Ortolani (University of Palermo, Italy)

PHD FORUM CHAIR
Mario Di Francesco (Aalto University, Finland)

PUBLICATION CHAIR
Francesco Longo (University of Messina, Italy)

REGISTRATION AND FINANCE CHAIR
Carmen Au (Hong Kong Polytechnic University, Hong Kong)
Maciej Zawodniok (Missouri University of Science and Technology, USA)

PUBLICITY CO-CHAIRS
Marco Tiloca (RISE SICS, Sweden)
Weigang Wu (Sun Yat-sen University, China)
Marco Levorato (University of California at Irvine, USA)

LOCAL ARRANGEMENTS CHAIR
Rossana Morana (University of Messina, Italy)

WEB CHAIR
Francesca Righetti (University of Pisa, Italy)

STEERING COMMITTEE
Jiannong Cao (Hong Kong Polytechnic University, Hong Kong)
Sajal K. Das (Missouri University of Science and Technology, USA)
Giuseppe Anastasi (University of Pisa, Italy)
Vijayakumar Bhagavatula (Carnegie Mellon University, USA)
Victor Leung (The University of British Columbia, Canada)
Neeraj Suri (Technische Universität Darmstadt, Germany)
Albert Zomaya (The University of Sydney, Australia)

TECHNICAL PROGRAM COMMITTEE
Tarek Abdelzaher, University of Illinois at Urbana-Champaign, United States
Carmen Au, PolyU, Hong Kong
Christian Becker, University of Mannheim, Germany
Paolo Bellavista, University of Bologna, Italy
Dario Bruneo, University of Messina, Italy
Sriram Chellappan, University of South Florida, United States
Sinem Coleri Ergen, Koc University, Turkey
Debraj De, Missouri University of Science & Technology, United States
Alessandra De Paola, University of Palermo, Italy
Mario Di Francesco, Aalto University, Finland
Gianluca Dini, University of Pisa, Italy
Salvatore Distefano, University of Messina, Italy
Anna Förster, University of Bremen, Germany
Mohammad Hajiesmaili, The Chinese University of Hong Kong, Hong Kong
Qi Han, Colorado School of Mines, United States
Hai Jin, Huazhong University of Science and Technology, China
Salil Kanhere, The University of New South Wales, Australia
Fanxin Kong, University of Pennsylvania, United States
Chi Harold Liu, Beijing Institute of Technology, China
Francesco Longo, University of Messina, Italy
Muthucumaru Maheswaran, McGill University, Canada
Francesco Marcelloni, University of Pisa, Italy
Giovanni Merlino, University of Messina, Italy
Marco Morana, University of Palermo, Italy
Kyung-Joon Park, DGIST, South Korea
Andrea Passarella, IIT-CNR, Italy
Dirk Pesch, Cork Institute of Technology, Ireland
Omer Rana, Cardiff University, United Kingdom
Nirmalya Roy, University of Maryland Baltimore County, United States
Simone Silvestri, University of Kentucky, United States
Neeraj Suri, TU Darmstadt, Germany
Athena Vakali, Aristotle University of Thessaloniki, Greece
Carlo Vallati, University of Pisa, Italy
O.P. Vyas, Pt. Ravishankar Shukla University Raipur, India

-- 
Marco Tiloca, PhD
Research Institutes of Sweden
RISE ICT/SICS
Isafjordsgatan 22 / Kistagången 16
SE-164 40 Kista (Sweden)
Phone: +46 (0)70 60 46 501
https://www.sics.se
https://www.sics.se/~marco/

The RISE institutes Innventia, SP and Swedish ICT
have merged in order to become a stronger research
and innovation partner for businesses and society.
SICS Swedish ICT AB, has now changed name to RISE SICS AB.


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